High Thermal Conductivity Aluminum Nitride Ceramics

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Description

Aluminum nitride (AlN) ceramic represents a novel ceramic material renowned for its exceptional comprehensive properties. It boasts a range of outstanding attributes, including remarkable thermal conductivity, reliable electrical insulation, low dielectric constant, and minimal dielectric loss. It is characterized by non-toxicity and thermal expansion compatibility with silicon, rendering it an ideal choice for cutting-edge applications like highly integrated semiconductor substrates and electronic device packaging. With a decomposition temperature reaching up to 2450℃ at room temperature, it serves as a versatile material for crucibles, evaporation boats, thermocouple protection tubes, and high-temperature insulating components used in the smelting of non-ferrous metals and semiconductor materials like gallium arsenide. Simultaneously, it finds utility as a high-temperature corrosion-resistant structural ceramic and transparent aluminum nitride ceramic.

Key Features:

  1. Exceptionally high thermal conductivity (up to 170W/m · K), comparable to BeO and SiC, exceeding Al2O3 by more than fivefold.
  2. Thermal expansion coefficient (4.5 × 10-6/℃) closely matching Si (3.5-4 × 10-6/℃) and GaAs (6 × 10-6/℃).
  3. Outstanding electrical properties encompassing dielectric constant, dielectric loss, volume resistivity, and dielectric strength.
  4. Strong mechanical attributes, exhibiting higher bending strength than Al2O3 and BeO ceramics, and amenable to sintering under normal pressure.
  5. Notable optical transmission characteristics.
  6. Effective insulation properties and resistance to plasma etching.

Applications:

  1. Aluminum nitride ceramic substrates, featuring high thermal conductivity, low expansion coefficient, strength, high-temperature resilience, chemical resistance, resistivity, and low dielectric loss. These make it an optimal choice for heat dissipation substrates and packaging materials in large-scale integrated circuits.
  2. Aluminum nitride serves as a novel, high-hardness wear-resistant ceramic material, surpassing traditional aluminum oxide, suitable for parts subjected to severe wear.
  3. Leveraging AIN ceramics’ heat resistance, melt erosion resistance, and thermal shock resistance, it finds application in crafting GaAs crystal crucibles, Al evaporating dishes, magnetohydrodynamic power generation devices, corrosion-resistant parts for high-temperature turbines, and infrared windows due to its optical properties. AlN thin films are used for high-frequency piezoelectric components, VLSI substrates, and more.
  4. The heat-resistant, molten metal-corrosion-resistant, and acid-stable nature of aluminum nitride makes it ideal for smelting crucibles for metals like aluminum, copper, silver, lead, and for sintering and casting die materials. When exposed to humid air, a thin oxide film forms on the surface, enhancing its functionality.

Technique Data

Item Unit Property Index
    AN170 AN200 AN220
Color – Gray Gray Beige
Water Absorption % 0 0 0
Volume Density g/cm3 ≥3.3 ≥3.3 ≥3.26
Surface Roughness Um 0.1-0.6 0.1-0.6 0.1-0.6
Camber Length‰ ≤2 ≤2 ≤2
Thermal Conductivity(20℃) W/m.k ≥170 ≥200 ≥220
Coefficient of thermal expansion 20℃~300℃(*10-6/℃) 4.6 4.6 4.5
40℃~800℃(*10-6/℃) 5.2 5.2 5.2
Bending Strength Mpa ≥450 ≥300 ≥200
Modulus Strength Gpa 320 310 310
Moh’s hardness – 8 8 8
Dielectric Strength KV/mm ≥17 ≥16 ≥15
Volume Resistivity Ω.cm ≥1014 ≥1014 ≥1013
Dielectric constant – 9 8.6 8.5
Dielectric Loss X10-4 2.98 2 2

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